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Thermal Interface
FrozenCPU only offers the best when it comes to computer thermal conducting compound, thermal grease, pc thermal epoxy and thermal adhesive, thermal tape, and thermal material remover and purifying products.

FrozenCPU highly recommends the entire Artic Silver product line for your pc thermal needs.


ArctiClean 1 & 2 (Thermal Material Remover and Surface Purifier) - 60ml Kit
ArctiClean 1 & 2 (Thermal Material Remover and Surface Purifier) - 60ml Kit Introducing ArctiClean from Arctic Silver, the first retail product to emerge from the union of Arctic Silver and Nanotherm technology. ArctiClean is a two-step cleaning process that removes existing thermal grease or pads and prepares the thermal surface for a fresh application of thermal interface material.
176 In Stock, Ships Today Till 6pm EST
$5.95
Tuniq TX-2 Non-Conductive Thermal Grease - 3.5g
Tuniq TX-2 Non-Conductive Thermal Grease - 3.5g TX-2 achieves the best interface between your CPU and the heatsinks by its unique designed molecular size and shape. Without any metal or electric conductive, Tuniq TX2 is safe, reliable and the most effective thermal compound for your valuable CPUs and coolers.
24 In Stock, Ships Today Till 6pm EST
$5.99
Arctic Alumina Adhesive (Premium Ceramic Thermal Epoxy) - 5 Gram set (AATA-5G)
Arctic Alumina Adhesive (Premium Ceramic Thermal Epoxy) - 5 Gram set (AATA-5G) Arctic Alumina Thermal Adhesive is not intended to be used between a CPU and the CPU heatsink. For CPU applications only use Arctic Silver Thermal Compounds. Arctic Silver Adhesive is probably the best adhesive out there for thermal layering and bonding for heatsinks. A set of Arctic Alumina Thermal Adhesive consists of two tubes containing ...
44 In Stock, Ships Today Till 6pm EST
$8.50
Innovation Cooling Diamond "24 Carat" Thermal Compound - 4.8 Grams
Innovation Cooling Diamond "24 Carat" Thermal Compound - 4.8 Grams IC Diamond 24 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond's superior thermal conductivity Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver. Diamond's five times better thermal conductivity compared to s...
41 In Stock, Ships Today Till 6pm EST
$22.50

Thermal Interface Categories
  Alcohol Swabs Indigo Xtreme™ Clean Tuniq Cleaning
  Arctic ArctiClean Spire Cleaning Thermal Applicators
 
 
  Akust Compounds Dimastech Compounds Spire Compounds
  Alphacool Compounds Evercool Compounds Sunbeam Compounds
  Arctic Compounds Gelid Compounds Swiftech Compounds
  Arctic Silver Indigo Xtreme™ ETI TFC-Feser Compounds
  Artic Alumina Noctua Compounds ThermalRight Compounds
  Asetek Compounds Phobya Compounds Timtronics Compounds
  Cooler Master Compounds Prolimatech Compounds Tuniq Compounds
  Cooljag Compounds Scythe Compounds Zalman Compounds
  Coollaboratory Shin-Etsu Compounds Innovation Cooling Compounds
  Deep Cool Compounds  
 
 
  Thermal Pad - 0.5mm Thermal Pad - 3.0mm Thermal Pad - Mosfet
  Thermal Pad - 0.7mm Thermal Pad - 5.0mm Thermal Pad - Motherboard
  Thermal Pad - 1.0mm Thermal Pad - 6.0mm Thermal Pad - RAM
  Thermal Pad - 1.5mm Premium Thermal Pads Thermal Pad - VGA Block
  Thermal Pad - 2.0mm Extreme Thermal Pads Thermal Copper Shims
  Thermal Pad - 2.5mm Ultra Extreme Thermal Pads Thermal Tape
 
 
  Compact Thermometers Pistol-Grip Thermometers  
 
 
  Arctic Adhesives Phobya Adhesives  

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Thermal Interface

  1. Arctic Silver 5 (High-Density Silver Thermal Compound) - 12 Grams (AS5-12G)Arctic Silver 5 (High-Density Silver Thermal Compound) - 12 Grams (AS5-12G)
    Arctic Silver 5 is optimized for use between modern high-power CPUs and high performance heatsinks or water cooling solutions. Arctic Silver 5 uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. Arctic Silver 5 also contains micronized zinc oxide, aluminum oxide and ...
  2. Arctic Silver 5 (High-Density Silver Thermal Compound) - 3.5 Grams (AS5-3.5G)Arctic Silver 5 (High-Density Silver Thermal Compound) - 3.5 Grams (AS5-3.5G)
    Arctic Silver 5 is optimized for use between modern high-power CPUs and high performance heatsinks or water cooling solutions. Arctic Silver 5 uses three unique shapes and sizes of pure silver particles to maximize particle-to-particle contact area and thermal transfer. Arctic Silver 5 also contains micronized zinc oxide, aluminum oxide and ...
  3. ArctiClean 1 & 2 (Thermal Material Remover and Surface Purifier) - 60ml KitArctiClean 1 & 2 (Thermal Material Remover and Surface Purifier) - 60ml Kit
    Introducing ArctiClean from Arctic Silver, the first retail product to emerge from the union of Arctic Silver and Nanotherm technology. ArctiClean is a two-step cleaning process that removes existing thermal grease or pads and prepares the thermal surface for a fresh application of thermal interface material.
  4. Innovation Cooling Diamond "7 Carat" Thermal Compound - 1.5 GramsInnovation Cooling Diamond "7 Carat" Thermal Compound - 1.5 Grams
    IC Diamond 7 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond's superior thermal conductivity Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver. Diamond's five times better thermal conductivity compared to si...
  5. Shin-Etsu X23-7783D Silicone Thermal Compound - 1gShin-Etsu X23-7783D Silicone Thermal Compound - 1g
    Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23-7783D thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23-7783D to dissipate heat enables users to reduce the overall cost o...
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- Jack T.
   February 06, 2012

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