The high-density, ceramic-based thermal compound specifically designed for modern high-power CPUs and high-performance heatsinks or water-cooling solutions.

The Evolution of Cool!

Download the Material Safety Data Sheet

High-Density ceramic content:

• Céramique uses a high-density layered composite of five unique shapes of thermally conductive aluminum oxide, boron nitride and zinc oxide sub-micron particles to maximize particle-to-particle contact area and thermal transfer. This exclusive combination provides performance exceeding most metal based compounds.

Controlled Triple-Phase Viscosity:

• Céramique does not contain any silicone.
• The suspension fluid is a proprietary mixture of advanced polysynthetic oils that provide superior performance and long-term stability.
• During the system's initial use, the heat from the CPU lowers the viscosity of the compound to enhance the filling of the microscopic valleys and ensure a minimum bond line between the heatsink and the CPU core. Then the compound thickens slightly over the next 100 to 300 hours of use to its final consistency designed for long-term stability. (This should not be confused with conventional phase change pads that are pre-attached to many heatsinks. Those pads melt each time they get hot then re-solidify when they cool. The viscosity changes that Céramique goes through are much more subtle and ultimately much more effective.)

Excellent Stability:

• Céramique is engineered to not separate, run, migrate, or bleed.

Electrical Insulator:

• Céramique does not contain any metal or other electrically conductive materials. It is a pure electrical insulator, neither electrically conductive nor capacitive.

Performance:

• 2 to 10 degrees centigrade lower CPU full load core temperatures than standard thermal compounds or thermal pads when measured with a calibrated thermal diode imbedded in the CPU core.

Easy Clean Up:

• Céramique can easily be cleaned from CPUs and heatsinks with isopropyl alcohol or any of the cleaners listed in the product instructions.

Innovative Dispenser:

• The 2.5-gram Céramique is the first product available which uses a proprietary thermal compound syringe. The new syringe is more compact, easier to handle and dispenses a higher percentage of its content than standard industrial or medical syringes. The amount of compound remaining in the syringe is easy to determine as the rear of the plunger is perfectly flush with the flange when the syringe is empty.

Thermal Resistance:	<0.007°C-in2/Watt (0.001 inch layer)
Thermal Conductance:	>200,000W/m2.°C (0.001 inch layer)
Average Particle Size:	<0.38 microns <0.000015 inch ( 67 particles lined up in a row equal 1/1000th of an inch. )
Temperature limits:	Peak –150°C to >180°C Long-Term –150°C to 125°C
Coverage Area:	2.5-gram syringes. (About 1cc) At a layer 0.003" thick, one tube will cover approximately 20 square inches.

02-04-2008
Reviewer: pecty (1)
Used on my C2D 6750 and on my eVGA SSC 8800GTS and working great.

11-24-2007
Reviewer: Franzkefka (13)
This stuff is great used it on my 8800 when i installed my full coverage waterblock, wasnt being greatly carful with this stuff as its 100% non conductive. This stuff is probably the Best non conductive thermal paste to date. my only complaint is its a bit on the gooie side, tends to get stringy like cheese on a hot pizza when your getting it out of the tube tends to leave little strings on stuff.