The Coollaboratory Liquid MetalPad Thermal Interface Pad is the first heat conduction pad composed of 100% metal and melts with heat from the processor (Burn In-process), and then it performs superior heat transfer. It dissipates the heat fast and efficiently, outperforming the best heat conduction pastes. The simple, clean and fast installation turns the Liquid MetalPad into the ultimate heat conduction medium for High End PCs.
The Liquid MetalPad can be used with all on the cooling market commercially available materials, for instance aluminum or copper! It doesn´t age and doesn´t have to be exchanged regularly. The Coollaboratory Liquid MetalPad is RoHS compatible and absolute nontoxic.
The Coollaboratory Liquid MetalPad is delivered in a transparent blister-package and contains three Liquid MetalPads. Additionally there is a detailed printed manual included and a cleaning set for removal / cleaning of the contact area before and after using the Liquid MetalPad.
Download Manual (PDF)
Download the Material Safety Data Sheet
Total Reviews: 1
Average Rating: 
I read somewhere.....
02-15-2007
Reviewer: Phizzle (5)
I saw a review for this stuff somewhere. I think the link for it was over at FrostyTech.com. The stuff doesn''t melt at 58deg/c like stated in the specs, more like 68-69deg/c. It gives temps that are a few degrees higher than artic silver 5. They had there chip at 49 deg/c load on this stuff and on as5 it was 46 deg/c. I suppose if it were to melt it might do better. This stuff might be good for a qx6700 or gpu bc temps on those generally go up that high on load.