The Enzotech MOS-C1 MOSFET Heatsinks were designed to offer exceptional heat dissipation for integrated MOSFET motherboards and video cards. The heatsinks are made using a forged copper process which produces a dense material that is extremely efficient at heat dissipation. The Enzotech MOS-C1 sinks are far superior to traditional heat sinks currently found on the market and provide the best thermal conductivity available.

Caution: The following situation can result in the heatsink falling off the MOSFET:

• MOSFET surface was not properly cleaned prior to affixing heatsink.
• Thermal tapes cannot be reused. If the MOSFET heatsink must be removed, do not use the same thermal tape to re-attach it. Both surfaces must be completely cleaned and a new thermal interface tape must be applied.
• When cleaning mating surface, be sure to follow directions supplied with cleaning product to insure safety for yourself and others.
• Do not swallow and keep contents away from children.

• Compatible with all Motherboards
• Forged pure copper
• Easy installation with thermal tape
• Multipack - 10 unit set

Dimensions:	6.5 x 6.5 x 12 mm (L x W x H)
Material:	C1100 Forged Copper
Weight:	2g (each)
Thermal Adhesive:	3M 8815 Thermal Tape