| Product Description |
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Features |
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Specifications |
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The Enzotech MOS-C1 MOSFET Heatsinks were designed to offer exceptional heat dissipation for integrated MOSFET motherboards and video cards. The heatsinks are made using a forged copper process which produces a dense material that is extremely efficient at heat dissipation. The Enzotech MOS-C1 sinks are far superior to traditional heat sinks currently found on the market and provide the best thermal conductivity available.
Caution: The following situation can result in the heatsink falling off the MOSFET: - MOSFET surface was not properly cleaned prior to affixing heatsink.
- Thermal tapes cannot be reused. If the MOSFET heatsink must be removed, do not use the same thermal tape to re-attach it. Both surfaces must be completely cleaned and a new thermal interface tape must be applied.
- When cleaning mating surface, be sure to follow directions supplied with cleaning product to insure safety for yourself and others.
- Do not swallow and keep contents away from children.
- Compatible with all Motherboards
- Forged pure copper
- Easy installation with thermal tape
- Multipack - 10 unit set
| Dimensions: |
6.5 x 6.5 x 12 mm (L x W x H) |
| Material: |
C1100 Forged Copper |
| Weight: |
2g (each) |
| Thermal Adhesive: |
3M 8815 Thermal Tape |
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