IC Diamond 24 Carat Thermal Compound maximizes thermal heat transfer between the CPU core and heatsink by taking advantage of diamond's superior thermal conductivity
Purified synthetic diamond has a thermal conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver.
Diamond's five times better thermal conductivity compared to silver makes it a superior heat transfer material for cooling high performance CPUs and is electrically non-conductive and non-capacitive.
Application: IC Diamond is composed mostly of diamond powder, and as such is quite thick. Proper application is critical to optimum performance. Squeeze onto the center of the CPU an amount of IC Diamond compound about the size of a pea - the center of the CPU is where most heat is concentrated. Place the heatsink on the CPU and push down to spread IC Diamond over the CPU's surface. Clamp the heatsink and power up the PC.
Curing Time: IC Diamond requires minimal time to attain peak performance; in most cases, IC Diamond will reach peak performance after two hours of use.
Stability: IC Diamond is designed for stability - it will not bleed or separate in normal use.
Download Application Instructions (PDF)
Download the Material Safety Data Sheet
Total Reviews: 8
Average Rating: 
Works As Advertised - Beware of Side-Effects
Awesome stuff once you get used to pre-heating parts before assembly. Can become VERY hard in long-term use on parts that get hot. Also tends to SCRATCH polished silicon and copper surfaces, so make sure to dissolve with IPA rather than scraping old compound off.
Hands Down Winner!
Its got the best heat transfer, Period. It could only be beaten by brazing the damn parts to getter, and that''s not gonna happen ... :)
Pluses:
1) Incredibly thermally conductive
2) Totally non conductive.
3) Reusable to an extent, because it "peels" off parts when its cold.
Minuses:
1) It''s almost solid at room temperature. You need to keep it on a "hot plate" at 60C to make it flowable, you have to pre-heat your card in the oven, and then you have to assemble as quickly as possible.
The "Single Application in Center of Die" is the only technique that works. If you have a liquid-cooled system, *by far* the easiest way to set the heatsink is to apply th compound to the die. gently attach the water-sink to the GPU board, the run *very* hot tap water through the heatsink while slowly tightening the screws.
Awesome
08-18-2011
Reviewer: Mr.Mike (1)
In my system, This stuff beat out MX-2 by -2c under load. The MX-2 beat good ole AS5 by -2c. It beats the best Shin-Etsu by -1c. I tested these compounds on an overclocked i7-930 @ 4.1ghz with a IFX-14 cooler.
If you want the best, then here it is. I does help to warm it up with a hairdryer before applying the block.
This stuff is very thick and difficult to apply but if you want the best then you have to be willing to put in the work.
It''s dark colored like AS5. Usually Dark Colored TIM''s last forever, unlike the white, pasty silicon stuff.
Amazing Compound
01-26-2011
Reviewer: Ping-PC (3)
Keeps our Intel i5-2400 running around 28-33c even under full stress load. It is pricey but you definitely get what you pay for. I would highly recommend this to anyone as we are going to start using this in every single one of our builds.
Works well but tough to apply.
Good results if applied well which is somewhat difficult due to the gritty/gooey consistency. Not for the novice.
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