| Product Description |
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Features |
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Specifications |
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The Cooler Master ThermalFusion 400 Thermal Compound is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. Its non-curing and non-electrical conductive traits can avoid any short circuit incidence. ThermalFusion 400 is the ultimate solution for thermal dissipation to improve CPU, GPU cooling and other bonding applications.
- High Thermal Conductivity
- Low Thermal Resistance
- Non-Curing
- Non-Corrosive
- Easy Application with Included Razor Blade
| Color: |
Gray |
| Specific Gravity: |
3.5 |
| Thermal Conductivity: |
2.89 W/m-K |
| Volume Resistivity: |
2.0E+10 ohm-cm |
| Thermal Resistance: |
0.032 °C-cm^2/W |
| Bond Line Thickness: |
0.008 mm |
| Volatile content: |
< 0.1 % |
| Net Weight: |
4 g |
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