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Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23-7783D thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23-7783D to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X23-7783D is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.
Total Reviews: 2 Average Rating:
Reviewer: NKrader (5)
Great Paste. lowered temps about 6c from average as5. to apply easyily get warm before trying to apply. as when its warm it is super easy to apply.
Excellent Temps but...12-20-2009
Reviewer: Sal Mucci (3)
very VERY difficult to apply. I get fantastic temperatures with this and my Mega but it was a pain to apply. Paste is very dry and breaks up while it is being spread on the CPU. Pea and line method will likely not work well with this paste. An even spread on both the CPU and the heatsink is recommended.