| Product Description |
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Features |
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Specifications |
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Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23-7783D thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23-7783D to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X23-7783D is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.
- Manufactured in Japan!
- Designed by Shin-Etsu
- Optimal Efficiency and Thermal Transfer
- Convenient Syringe Design for Easy Application
| Color: |
Gray |
| Viscosity (Pascal * Second): |
200 |
| Appearance: |
Grey |
| Bleed (423°K/24 hr): |
0 |
| Thermal Conductivity: |
6.0 (W/mK) |
| Specific Gravity: |
2.55 |
| Volatile Content: |
2.43% |
| Storage: |
Room Temperature (1 year) |
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