| Product Description |
|
Specifications |
|
|
ENZOTECH MST-66 heatsink was designed to offer exceptional heat dissipation for integrated MOSFET motherboards cards. MST-66 heatsink is made using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The MST-66 heatsink is far superior to traditional heat sinks currently found on the market and it provides the best thermal conductivity available to dissipate heat from the MOSFET in your system..
| Dimensions: |
72(L) x 13(W) x 29.6(H) |
| Material: |
C1100 Forged Copper |
| Weight: |
55 g |
| Thermal Adhesive: |
Fujipoly GR-d Thermal Tape |
| Supported Motherboards: |
GigaByte EX58-UD5 |
 Single Item Shipping Calculator |
Shipping Estimate |
|
Note: Shipping costs for multiple items will be less than individual shipping quotes. Please proceed to checkout to receive multiple item shipping quotes.
|
|
|