Indigo Xtreme™ (IX) represents a whole new approach to high-performance CPU cooling. IX is a precision Engineered Thermal Interface (ETI) that keeps CPUs a stunning 2-4C cooler than the highest performance greases or metallic thermal interface materials (TIMs) available today.
Its innovative and patent-pending structure deploys a highly conductive Phase Change Metal Alloy (PCMA) into all the surface micro-asperities on the CPU lid and heat sink, resulting in the lowest resistance heat path. Unlike messy greases and liquid metal interface products, IX is a self-contained and sealed structure, automatically deploying the correct amount of PCMA every time.

Based upon technology for high heat flux electronics, IX sets the new standard for thermal interface performance within the PC enthusiast community. No mere TIM can compete with Indigo Xtreme’s performance.

Instructions Guide

• Lowest overall thermal resistance of any TIM available today
• No cure time
• Most consistent performance - automatically applies the correct amount of alloy
• Fully compatible with all surfaces, including copper and aluminum
• Fully sealed structure - no mess or migration
• Easy clean-up – just peel to remove
• Laser-cut precision

What is Indigo Xtreme™
Indigo Xtreme™ is an Engineered Thermal Interface (ETI) that fits neatly between a CPU lid and heat sink (or waterblock) to keep CPUs cooler. Unlike greases, metallic thermal interface pads or liquid metal alloys, Indigo Xtreme™ is a self-contained and sealed structure, deploying a Phase Change Metallic Alloy (PCMA) which reflows and fills surface asperities on the CPU lid and heat sink. The resultant interfacial layer is void-free and robust, with low thermal contact and bulk resistance.
How Indigo Xtreme™ Works
The overall thermal performance of a thermal interface is the sum of the bulk thermal resistance (which is the inverse of bulk thermal conductance) of the material and its two surface contact resistances (on both the CPU lid and heat sink). Greases have good surface wetting properties and therefore they exhibit low contact resistance; however, they have high bulk thermal resistances. Metallic pads possess low bulk thermal resistances, but surface oxidation limits their surface wetting ability, resulting in higher contact resistance.
Indigo Xtreme™ achieves high thermal performance through the optimized deployment of molten, oxide-free PCMA, thereby yielding low contact resistance and low bulk resistance.
At the heart of the one-of-a-kind Indigo Xtreme™ ETI is a proven PCMA deployment structure. When heated (see Installation Guide), the sealed deployment structure directs flowing PCMA into CPU lid and heat sink micro-surface asperities while flushing out entrapped air. The asperity filling PCMA creates a corrosion-resistant hermetic (airtight) seal between the lid and heat sink, resulting in long-term reliability.
How to Use Indigo Xtreme™
The Indigo Xtreme™ ETI is offered as part of an Engineered Thermal Interface Kit. This kit includes several cleanroom-grade surface cleaning products to ensure the highest quality deployment possible. Once the CPU lid and heat sink surfaces have been prepared, the ETI is aligned to the lid and held in place with its own adhesive layer. Following the bolting of the heat sink to the motherboard, the ETI may be reflowed by simply running the CPU under load as seen in the Instruction Guide

Material:	Gallium-free phase change metal alloy
Bulk Thermal Conductivity:	>20 W/mK
Thermal Impedance:	0.04°C-cm2/W
Includes:	Indigo Xtreme ETIs (2 installations) Nitrile gloves (1 set) Solvent wiper pouches (2) Cleanroom-grade dry wipes (2) Detailed installation instructions

06-07-2011
Reviewer: Spyder (1)
I got 3C idle temp improvements and 6C load temp improvements over AS5 with my EK supreme HF block. Hard to get proper reflow on AMD cpus.