Silent cooling replacement for Intel stock coolers (0dB without fan). Offset base for better VGA card and memory clearance (PCI-e and RAM sockets) Active cooling (with fan) up to 300watt thermal design power (TDP) Black top to complement build aesthetics Enlarged copper base to ensure 100% contact with all CPUs including Haswell (2011-3 processors). Long neck screwdriver included for easy mounting. Motherboard Compatibility Intel: Socket LGA 775/1150/1151/1155/1156/1366/2011/2011-3 AMD: Socket AM2/AM2+/AM3/AM3+/AM4/FM1/FM2/FM2+

• Large heat-sink fins surface area with proprietary through holes on fins for efficient ventilation
• Fin stack moved next to rear system fan for low-noise fanless operation.
• Convex copper base design, to ensure the Highest thermal conducting thermal efficiency between the CPU and the heatsink

Intel:	Socket LGA 775/1150/1151/1155/1156/1366/2011/2011-3
AMD:	Socket AM2/AM2+/AM3/AM3+/AM4/FM1/FM2/FM2+
Dimension:	L150mm x W120mm x H159mm (Fin Area only)
Dimension:	L150mm x W146.5mm x H159mm (Heat sink incl.)
Weight:	900g
Heat pipes:	6mm heatpipe*7 units
Fin:	T = 0.4 mm ; Gap = 3.1 mm
Fin Pcs:	35 pcs
Copper Base:	C1100 Pure copper nickel plated
Motherboard to Fin:	36 + 8 = 44 mm 46 + 8=54 mm