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Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23-7783D thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23-7783D to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X23-7783D is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.
Total Reviews: 4 Average Rating:
Reviewer: ProCPU (6)
Stuff is the best. Nearly impossible to even have an air bubble in it. hard return> It is like a liquid metal. Goes on like a liquid, then hardens with the CPU heat cycle. How is this stuff so underrated? Bad SEO? Zero marketing? It is the best, and needs to be recognized as such.
Good TIM & Quick shipping.01-27-2011
Good TIM. Processing & Shipping was completely quick. Thanks FrozenCPU.
Reviewer: The-Echo (1)
One of the best thermal compounds i''ve used so far. Used it on my Noctua NH-D14 and droped the temps about 2-3c from the Noctua paste that came with the heat sink. Yea not hard to apply, just little bb in the mid of cpu put on heatsink twist it a bit then screw on heat sink done.
Reviewer: Louis (0)
Using this stuff with my Venomous X. Dropped my temps 3*C over MX-3. It''s not as thick as some people say, but let the heatsink do the spreading. Plenty in the tube for several applications. Give it a try- you won''t be sorry!