Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23-7783D thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23-7783D to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X23-7783D is designed to meet current and future thermal management requirements, thus providing drop-in solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.

• Manufactured in Japan!
• Designed by Shin-Etsu
• Optimal Efficiency and Thermal Transfer
• Convenient Syringe Design for Easy Application

Color:	Gray
Viscosity (Pascal * Second):	200
Appearance:	Grey
Bleed (423°K/24 hr):	0
Thermal Conductivity:	6.0 (W/mK)
Specific Gravity:	2.55
Volatile Content:	2.43%
Storage:	Room Temperature (1 year)

06-24-2011
Reviewer: ProCPU (6)
Stuff is the best. Nearly impossible to even have an air bubble in it. hard return> It is like a liquid metal. Goes on like a liquid, then hardens with the CPU heat cycle. How is this stuff so underrated? Bad SEO? Zero marketing? It is the best, and needs to be recognized as such.

01-27-2011
Reviewer: ()
Good TIM. Processing & Shipping was completely quick. Thanks FrozenCPU.

01-07-2011
Reviewer: The-Echo (1)
One of the best thermal compounds i''ve used so far. Used it on my Noctua NH-D14 and droped the temps about 2-3c from the Noctua paste that came with the heat sink. Yea not hard to apply, just little bb in the mid of cpu put on heatsink twist it a bit then screw on heat sink done.

07-16-2010
Reviewer: Louis (0)
Using this stuff with my Venomous X. Dropped my temps 3*C over MX-3. It''s not as thick as some people say, but let the heatsink do the spreading. Plenty in the tube for several applications. Give it a try- you won''t be sorry!